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Solder paste is a material used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through hole pin in paste components by print solder paste in/over the holes. The paste initially adheres components in place by being sticky, it is then heated (along with the rest of the board) melting the paste and forming a mechanical connection as well as an electrical connection. The paste is applied to the board by stencil printing and then the components are put in place by a pick-and-place machine or by hand.
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|Country of Origin / Manufacture / Assembly||: India|
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